- Series :
- Supplier Device Package :
4 Produits
| Photo. | Type | Prix | Quantité | Stocks | Fabricant | Description | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Regarder |
3,547
On a de la marchandise.
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NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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Regarder |
1,578
On a de la marchandise.
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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|
Regarder |
3,547
On a de la marchandise.
|
NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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|
|
Regarder |
1,578
On a de la marchandise.
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External |
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