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6 Produits
Photo. Type Prix Quantité Stocks Fabricant Description Series Part Status Packaging Operating Temperature Mounting Type Package / Case Interface Supplier Device Package Number of Circuits Voltage - Supply Function
DS34S132GN
Regarder
RFQ
819
On a de la marchandise.
Maxim Integrated IC TDM/PACKET TRANSPORT 676BGA - Discontinued at Digi-Key Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GNA2+
Unité
$209.8303
Regarder
RFQ
3,407
On a de la marchandise.
Maxim Integrated IC TDM PACKET 32PORT 676PBGA - Not For New Designs Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN+
Unité
$271.9500
Regarder
RFQ
1,334
On a de la marchandise.
Maxim Integrated IC TDM OVER PACKET 676-BGA - Active Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN
Regarder
RFQ
819
On a de la marchandise.
Maxim Integrated IC TDM/PACKET TRANSPORT 676BGA - Discontinued at Digi-Key Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GNA2+
Unité
$209.8303
Regarder
RFQ
3,407
On a de la marchandise.
Maxim Integrated IC TDM PACKET 32PORT 676PBGA - Not For New Designs Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)
DS34S132GN+
Unité
$271.9500
Regarder
RFQ
1,334
On a de la marchandise.
Maxim Integrated IC TDM OVER PACKET 676-BGA - Active Tray -40°C ~ 85°C Surface Mount 676-BGA TDMoP 676-TEPBGA (27x27) 1 1.8V, 3.3V TDM-over-Packet (TDMoP)