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Current - Max :
Current - Test :
Flux @ Current/Temperature - Test :
Light Emitting Surface (LES) :
4 Produits
Photo. Type Prix Quantité Stocks Fabricant Description Series Part Status Color Packaging Size / Dimension Type Height Configuration Current - Max Current - Test Voltage - Forward (Vf) (Typ) Wavelength Viewing Angle CCT (K) Flux @ Current/Temperature - Test Temperature - Test Lumens/Watt @ Current - Test Light Emitting Surface (LES) Lens Type
Default Photo
Unité
$2.3018
Regarder
RFQ
3,526
On a de la marchandise.
Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 13.50mm L x 13.50mm W Chip On Board (COB) 1.50mm Square 920mA 360mA 34.6V - 115° 3300K 1394 lm (Typ) 85°C 112 lm/W 9.80mm Diameter Flat
Default Photo
Unité
$5.4389
Regarder
RFQ
3,442
On a de la marchandise.
Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 2.3A 900mA 34.6V - 115° 3300K 3488 lm (Typ) 85°C 112 lm/W 14.50mm Diameter Flat
Default Photo
Unité
$2.3018
Regarder
RFQ
3,526
On a de la marchandise.
Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 13.50mm L x 13.50mm W Chip On Board (COB) 1.50mm Square 920mA 360mA 34.6V - 115° 3300K 1394 lm (Typ) 85°C 112 lm/W 9.80mm Diameter Flat
Default Photo
Unité
$5.4389
Regarder
RFQ
3,442
On a de la marchandise.
Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 2.3A 900mA 34.6V - 115° 3300K 3488 lm (Typ) 85°C 112 lm/W 14.50mm Diameter Flat